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High Temp ESD Waffle Trays for Semiconductor ICs

Name: High Temp ESD Waffle Trays for Semiconductor ICs
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24199
Price: 1.35 USD
Availability: InStock

Marka Adı:	Hiner-pack
Model Numarası:	HN24199
Moq:	500 adet
fiyat:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Ödeme Şartları:	T/T
Tedarik Yeteneği:	2000 adet/gün

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

Çin

Sertifika:

ROHS, ISO

Tepsi Ağırlığı:

Genellikle Kavite Başına 500 Grama Kadar Değişir

Renk:

Siyah

Kalite Güvencesi:

Teslimat garantisi, güvenilir kalite

Anahat Çizgi Boyutu:

50,8×50,8×3,94 mm

Kavite Boyutu:

4,1x4x0,9 mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Kalıp Tipi:

Enjeksiyon

Yeniden kullanılabilir:

Evet

Tepsi Şekli:

Dikdörtgen

Temiz Sınıf:

Genel ve Ultrasonik Temizleme

IC Türü:

BGA,QFP,QFN,LGA,PGA

Paketleme seviyesi:

Taşıma Paketi

Çarpıklık:

Çarpıklık MAX 0,2 mm

Kapasite:

7x7=49 Adet

Ambalaj bilgileri:

karton, palet

Yetenek temini:

2000 adet/gün

Ürün Tanımı

High Temp ESD Waffle Trays for Semiconductor ICs

Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.

Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.

Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.

Key Features/ Benefits

ESD protection
High temperature resistance
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24199
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		4.1x4x0.9 mm
Matrix QTY		7x7=49 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.

Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.

Packaging & Shipping/ Services

Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.

Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Etiketler:

Hızlı Bağlantı

Ev Hakkımızda Ürünler Davalar Haberler indirmek Bizimle İletişim

Hızlı iletişim

Adres

A11 Yapı, D Bölgesi, Batı Sanayi Bölgesi, Minzhu Topluluğu, Shajing Caddesi, Baoan Bölgesi, Shenzhen Şehri, GD Eyaleti Çin

Tel

+1-(408)-669-7847

E-posta

Rainbowzhu@hiner-pack.com

Rainbowzhu_1

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