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Durable JEDEC IC Trays for Wafer Safety and Clean Environments

Durable JEDEC IC Trays for Wafer Safety and Clean Environments

Marka Adı: Hiner-pack
Model Numarası: HN25015
Moq: 500 adet
fiyat: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Ödeme Şartları: T/T
Tedarik Yeteneği: 2000 adet/gün
Ayrıntılı Bilgiler
Menşe yeri:
Çin
Sertifika:
ROHS, ISO
Tepsi Ağırlığı:
Genellikle Kavite Başına 500 Grama Kadar Değişir
Renk:
Siyah
Kalite Güvencesi:
Teslimat garantisi, güvenilir kalite
Kavite Boyutu:
322,6×135,9×8,35 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Kalıp Tipi:
Enjeksiyon
Yeniden kullanılabilir:
Evet
Tepsi Şekli:
Dikdörtgen
Temiz Sınıf:
Genel ve Ultrasonik Temizleme
IC Türü:
BGA,QFP,QFN,LGA,PGA
Paketleme seviyesi:
Taşıma Paketi
Düzlük:
0,76 mm'den az
Kapasite:
12X6=72 Adet
Ambalaj bilgileri:
karton, palet
Yetenek temini:
2000 adet/gün
Ürün Tanımı
Durable JEDEC IC Trays for Wafer Safety and Clean Environments
Shield delicate semiconductor wafers in clean production environments. Provide reliable structural integrity to prevent component damage. Resist high temperatures up to 130°C for stable industrial performance. Seeking trusted tray solutions for secure wafer handling?

Fit automated production lines and cleanroom operations perfectly. Perform steadily in wafer transfer and storage procedures. Adapt to diverse semiconductor manufacturing workflows smoothly.

 Support fully customized cavity sizes and layout designs. Comply with industry standards for clean production. Deliver tailored solutions that meet unique semiconductor manufacturing requirements.
Key Features/ Benefits 
  • Sturdy structural integrity
  • Effective dust prevention
  • Clean production compatibility
  • Reliable wafer protection
  • Custom cavity & layout design
Specifications
Brand Hiner-pack
Model HN25015
Material PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×8.35 mm
Cavity Size 13×20.5×1.26 mm
Matrix QTY 12X6=72 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor wafer handling, high-temperature assembly, cleanroom production, and component storage operations. Adapt to automated manufacturing lines, cleanroom Class 100/1000 environments, and precision assembly system

Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, semiconductor foundries, and clean production facilities.
Customized Services
Provide tailored customization for JEDEC IC trays. Work closely with clients to define cavity pitch, pocket depth, and structural reinforcements for specific wafer types. Develop high-temperature resistant PPE material variants to meet 130°C process needs. Validate prototypes through vibration and temperature cycling tests, delivering personalized tray solutions that enhance clean production efficiency and protect wafers throughout manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers