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Clean Production JEDEC IC Trays for Wafer Protection

Marka Adı:	Hiner-pack
Model Numarası:	HN25012
Moq:	500 adet
fiyat:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ödeme Şartları:	T/T
Tedarik Yeteneği:	2000 adet/gün

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

Çin

Sertifika:

ROHS, ISO

Tepsi Ağırlığı:

Genellikle Kavite Başına 500 Grama Kadar Değişir

Renk:

Siyah

Kalite Güvencesi:

Teslimat garantisi, güvenilir kalite

Kavite Boyutu:

322,6×135,9×7,62 mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Kalıp Tipi:

Enjeksiyon

Yeniden kullanılabilir:

Evet

Tepsi Şekli:

Dikdörtgen

Temiz Sınıf:

Genel ve Ultrasonik Temizleme

IC Türü:

BGA,QFP,QFN,LGA,PGA

Paketleme seviyesi:

Taşıma Paketi

Düzlük:

0,74 mm'den az

Kapasite:

11X26=286 adet

Ambalaj bilgileri:

karton, palet

Yetenek temini:

2000 adet/gün

Ürün Tanımı

Clean Production JEDEC IC Trays for Wafer Protection

Shield delicate semiconductor wafers from dust and damage during production and handling. Maintain clean production environment effectively. Built with sturdy structure to meet JEDEC standards for long-term industrial use. Looking for reliable tray solutions for wafer protection?

Fit automated assembly lines and packaging plants perfectly. Perform steadily in wafer transfer and packaging procedures. Adapt to diverse semiconductor manufacturing processes smoothly.

Enable safe wafer storage and factory logistics. Support custom designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.

Key Features/ Benefits

Strong durable structure
Effective dust prevention
Safeguard wafer packaging processes
Clean production support
Flexible customization

Specifications

Brand		Hiner-pack
Model		HN25012
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		4×4×0.75 mm
Matrix QTY		11X26=286 PCS
Warpage		MAX 0.74mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve semiconductor front-end processing, wafer probing, final assembly, and device testing operations. Adapt to cleanroom Class 100/1000 environments, automated material handling systems, and high-temperature manufacturing processes.

Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, foundries, and outsourced semiconductor assembly and test facilities.

Customized Services

Offer end-to-end customization for JEDEC IC trays. Collaborate with engineering teams to define cavity pitch, pocket depth, and material properties for specific wafer sizes and thicknesses. Develop anti-static or high-temperature resistant variants, and validate prototypes through in-house testing. Deliver fully tailored tray solutions that optimize production flow and minimize contamination risks for advanced semiconductor manufacturing.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Etiketler:

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

Clean Production JEDEC IC Trays for Wafer Protection

Clean Production JEDEC IC Trays for Wafer Protection

IC esd tepsisi

DRAM ESD Bileşen Tepsisi

ESD Nakliye Tepsileri

Mikro Bileşenler için Hiner Pack Standart Renkli JEDEC IC Tepsileri

ISO 9001 Isıya Dayanıklı JEDEC IC Tepsileri Çipi Korur ESD PPE MPPO Standardı

Normal Boyutlu Renkli Antistatik Nakliye Tepsileri IC Bileşeni için Termostabil

Sıcaklığa Dirençli Antistik JEDEC IC Tepsileri Elektronik Bileşenler Tepsisi

PPE MPPO Antistik Standart JEDEC Tepsisi El Yapımı Seçiminden Kaçınır