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Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Marka Adı:	Hiner-pack
Model Numarası:	HN25011
Moq:	500 adet
fiyat:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ödeme Şartları:	T/T
Tedarik Yeteneği:	2000 adet/gün

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

Çin

Sertifika:

ROHS, ISO

Tepsi Ağırlığı:

Genellikle Kavite Başına 500 Grama Kadar Değişir

Renk:

Siyah

Kalite Güvencesi:

Teslimat garantisi, güvenilir kalite

Kavite Boyutu:

322,6×135,9×7,62 mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Kalıp Tipi:

Enjeksiyon

Yeniden kullanılabilir:

Evet

Tepsi Şekli:

Dikdörtgen

Temiz Sınıf:

Genel ve Ultrasonik Temizleme

IC Türü:

BGA,QFP,QFN,LGA,PGA

Paketleme seviyesi:

Taşıma Paketi

Düzlük:

0,76 mm'den az

Kapasite:

20x9=180 Adet

Ambalaj bilgileri:

karton, palet

Yetenek temini:

2000 adet/gün

Ürün Tanımı

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Guard delicate semiconductor wafers during production and handling. Sustain clean working environment and block dust particles effectively. Comply with JEDEC standards for reliable industrial use. Seeking trusted tray solutions for wafer packaging and storage?

Integrate seamlessly with automated assembly lines and packaging plants. Perform consistently in wafer transfer and packaging procedures. Adapt smoothly to diverse semiconductor manufacturing processes.

Facilitate safe storage and factory logistics of wafers. Support custom cavity designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.

Key Features/ Benefits

Strong durable structure
Effective dust prevention
Safeguard wafer packaging processes
Comply with JEDEC standards
Flexible customization

Specifications

Brand		Hiner-pack
Model		HN25011
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		8.5×8.5×0.9 mm
Matrix QTY		20x9=180 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer packaging, component testing, die sorting and semiconductor manufacturing. Fit cleanroom operations, automated assembly lines and packaging plants. Ensure stable performance in rigorous industrial environments.

Also used in wafer storage, factory logistics, production turnover and sample shipment. Serve semiconductor manufacturers, testing institutions and electronic component suppliers.

Customized Services

Offer comprehensive customization services for JEDEC IC trays. Collaborate closely with customers to analyze unique wafer specifications, production workflows, and environmental requirements. Modify cavity dimensions, grid layouts, material selections, and structural designs to perfectly match diverse wafer types and manufacturing scenarios. Provide end-to-end support from prototype testing to final production, delivering personalized tray solutions that enhance production efficiency, minimize contamination risks, and fully address specialized semiconductor manufacturing needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Etiketler:

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

IC esd tepsisi

DRAM ESD Bileşen Tepsisi

ESD Nakliye Tepsileri

Mikro Bileşenler için Hiner Pack Standart Renkli JEDEC IC Tepsileri

ISO 9001 Isıya Dayanıklı JEDEC IC Tepsileri Çipi Korur ESD PPE MPPO Standardı

Normal Boyutlu Renkli Antistatik Nakliye Tepsileri IC Bileşeni için Termostabil

Sıcaklığa Dirençli Antistik JEDEC IC Tepsileri Elektronik Bileşenler Tepsisi

PPE MPPO Antistik Standart JEDEC Tepsisi El Yapımı Seçiminden Kaçınır