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Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Marka Adı:	Hiner-pack
Model Numarası:	HN25001
Moq:	500 adet
fiyat:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ödeme Şartları:	T/T
Tedarik Yeteneği:	2000 adet/gün

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

Çin

Sertifika:

ROHS, ISO

Tepsi Ağırlığı:

Genellikle Kavite Başına 500 Grama Kadar Değişir

Renk:

Siyah

Kalite Güvencesi:

Teslimat garantisi, güvenilir kalite

Kavite Boyutu:

322,6×135,9×12,19 mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Kalıp Tipi:

Enjeksiyon

Yeniden kullanılabilir:

Evet

Tepsi Şekli:

Dikdörtgen

Temiz Sınıf:

Genel ve Ultrasonik Temizleme

IC Türü:

BGA,QFP,QFN,LGA,PGA

Paketleme seviyesi:

Taşıma Paketi

Düzlük:

0,76 mm'den az

Kapasite:

7x12=84 Adet

Ambalaj bilgileri:

karton, palet

Yetenek temini:

2000 adet/gün

Ürün Tanımı

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Reduce dust contamination effectively. Protect delicate semiconductor components during wafer level packaging. Offer reliable structural durability for repeated industrial use. Need stable IC tray solutions for clean production?

Fit automated semiconductor packaging lines. Adapt to wafer level processing and component handling workflows. Maintain cleanroom compatibility and consistent performance.

Support safe component storage and logistics. Offer customizable cavity layouts and sizes. Create tailored JEDEC tray designs to match unique packaging requirements.

Key Features/ Benefits

Deliver durable construction.
Reduce dust contamination.
Safeguard wafer packaging processes.
Comply with JEDEC standards.
Support custom design solutions.

Specifications

Brand		Hiner-pack
Model		HN25001
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×12.19 mm
Cavity Size		16×9.5×4.72 mm
Matrix QTY		7x12=84 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Etiketler:

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

Durable JEDEC IC Trays for Dust Control and Semiconductor Wafer Packaging Protection

IC esd tepsisi

DRAM ESD Bileşen Tepsisi

ESD Nakliye Tepsileri

Mikro Bileşenler için Hiner Pack Standart Renkli JEDEC IC Tepsileri

ISO 9001 Isıya Dayanıklı JEDEC IC Tepsileri Çipi Korur ESD PPE MPPO Standardı

Normal Boyutlu Renkli Antistatik Nakliye Tepsileri IC Bileşeni için Termostabil

Sıcaklığa Dirençli Antistik JEDEC IC Tepsileri Elektronik Bileşenler Tepsisi

PPE MPPO Antistik Standart JEDEC Tepsisi El Yapımı Seçiminden Kaçınır