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ESD Anti Static Semiconductor Waffle Chip Trays

ESD Anti Static Semiconductor Waffle Chip Trays

Marka Adı: Hiner-pack
Model Numarası: HN24171
Moq: 500 adet
fiyat: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Ödeme Şartları: T/T
Tedarik Yeteneği: 2000 adet/gün
Ayrıntılı Bilgiler
Menşe yeri:
Çin
Sertifika:
ROHS, ISO
Tepsi Ağırlığı:
Genellikle Kavite Başına 500 Grama Kadar Değişir
Renk:
Siyah
Kalite Güvencesi:
Teslimat garantisi, güvenilir kalite
Anahat Çizgi Boyutu:
50,8×50,8×3,94 mm
Kavite Boyutu:
4,64x4,22x0,755 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Kalıp tipi:
Enjeksiyon
Yeniden kullanılabilir:
Evet
Tepsi Şekli:
Dikdörtgen
Temiz Sınıf:
Genel ve Ultrasonik Temizleme
IC Türü:
BGA,QFP,QFN,LGA,PGA
Paketleme seviyesi:
Taşıma Paketi
Çarpıklık:
Çarpıklık MAX 0,26 mm
Kapasite:
6x7=42 Adet
Ambalaj bilgileri:
karton, palet
Yetenek temini:
2000 adet/gün
Ürün Tanımı
ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?


Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.


Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24171
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 4.64x4.22x0.755 mm
Matrix QTY 6x7=42 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.


Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services
Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers