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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Marka Adı: Hiner-pack
Model Numarası: HN24132
Moq: 500 adet
fiyat: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Ödeme Şartları: T/T
Tedarik Yeteneği: 2000 adet/gün
Ayrıntılı Bilgiler
Menşe yeri:
Çin
Sertifika:
ROHS, ISO
Tepsi Ağırlığı:
Genellikle Kavite Başına 500 Grama Kadar Değişir
Renk:
ESD koruması için genellikle siyah veya koyu gri
Kalite Güvencesi:
Teslimat garantisi, güvenilir kalite
Kavite Boyutu:
5,0x3,35x1,20 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Kalıp tipi:
Enjeksiyon
Yeniden kullanılabilir:
Evet
Tepsi Şekli:
Dikdörtgen
Temiz Sınıf:
Genel ve Ultrasonik Temizleme
IC Türü:
BGA,QFP,QFN,LGA,PGA
Paketleme seviyesi:
Taşıma Paketi
Çarpıklık:
Çarpıklık MAX 0,3 mm
Kapasite:
9x7=63 adet
Ambalaj bilgileri:
karton, palet
Yetenek temini:
2000 adet/gün
Ürün Tanımı
Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.


Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.


Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24132
MaterialMPPO
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×7.4 mm
Cavity Size5.0x3.35x1.20 mm
Matrix QTY9x7=63 PCS
WarpageMAX 0.2mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers