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2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

Marka Adı:	Hiner-pack
Model Numarası:	HN24125
Moq:	500
fiyat:	TBC
Ödeme Şartları:	100% Prepayment
Tedarik Yeteneği:	2000PCS/Day

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

SHENZHEN ÇİN

Sertifika:

ISO 9001 ROHS SGS

Incoterms:

EXW, FOB, CIF, DDU, DDP

Yeniden kullanılabilir:

Evet

Kalıplama Yöntemi:

Enjeksiyon Kalıplama

Mülk:

ESD

Boyutlar:

50,7x50,7x4mm

kullanmak:

Nakliye, depolama, paketleme

Renk:

Siyah

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Ürün Tanımı

Permanent Antistatic Specialized Small Parts Waffle Pack Chip Trays

Constructed from permanently conductive ABS or PC resins, these waffle packs provide a secure path for electrostatic discharge, protecting sensitive gates and circuitry from the moment they are sorted until they are placed. The tray’s thin profile and regular rib pattern create a stable environment that minimizes the gap between the component and the tray cover, effectively preventing thin die from sliding out of their designated pockets during high-acceleration transport within the assembly facility.

Key Features/ Benefits

Anti-Migration Pocket Geometry
Superior Dimensional Stability and Flatness
Permanent ESD Protection (RoHS Compliant)
Interlocking Stackable Architecture
Cleanroom-Ready Purity

Specifications

Brand		Hiner-pack
Model		HN24125
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x5.5mm
Cavity Size		8.22×1.88×0.30mm
Matrix QTY		4X14=56PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These automation-optimized waffle packs are the preferred choice for High-Volume Semiconductor Assembly and Advanced SMT (Surface Mount Technology) Lines. They are primarily utilized in: Automated Die Sorting, where high-speed flip-chip or wire-bond systems require perfect tray alignment; Precision Kitting for R&D, allowing for the organized and safe movement of diverse component sets through automated test flows; and High-Speed Optoelectronic Packaging, where stable component orientation is vital for lens alignment. Their compact size and standardized footprint also make them ideal for Small Batch Prototyping on production-grade equipment, providing a seamless transition from engineering samples to full-scale manufacturing. Whether you are using manual feeders or advanced robotic handlers, these trays provide the consistency needed for modern micro-manufacturing.

Customization

We provide extensive customization options to ensure the waffle pack fits your specific automated toolset. Our engineering team can add Specialized Chamfers or Tapered Walls to the pockets to further facilitate high-speed tool entry and exit. Customization also includes the addition of Vision Alignment Fiducials or specialized reference marks molded directly into the frame to improve the speed of machine vision recognition. We offer various material grades, from cost-effective Conductive ABS for ambient transport to specialized resins with different colors for lot identification. With a catalog of existing designs, we can often adapt a solution for your unique component geometry in as little as two weeks, ensuring your automated line is supported by a high-precision, customized carrier.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Etiketler:

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

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