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Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Marka Adı:	Hiner-pack
Model Numarası:	HN23072
Moq:	500 adet
fiyat:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Ödeme Şartları:	% 100 Ödeme
Tedarik Yeteneği:	2000 adet/gün

Ayrıntılı Bilgiler

Ürün Tanımı

Ayrıntılı Bilgiler

Menşe yeri:

Çin

Sertifika:

RoHS、ISO

Matris:

4×13=52PCS

Nem direnci:

% 90'a kadar

Kavite Boyutu:

21,18x16,08x2,6 mm

Ağırlık kapasitesi:

Genellikle Kavite Başına 500 Grama Kadar Değişir

UV Dayanımı:

Evet

Çarpıklık:

0,76 mm'den az

Yeniden kullanılabilirlik:

Yeniden kullanılabilir

Başvuru:

IC Kullanımı, Depolama ve Nakliye

Ambalaj bilgileri:

70 ~ 100 adet/karton (Müşteri talebine göre)

Yetenek temini:

2000 adet/gün

Ürün Tanımı

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles.

Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment.

Key Features/ Benefits

Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.
Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components.
Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.
Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.
Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.
Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.

Specifications

Brand		Hiner-pack
Model		HN23072
Material		MPPO/PPE
Package Type		BGA,QFP,QFN,LGA,PGA
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		21.18x16.08x2.6mm
Matrix QTY		4×13=52PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

Engineered for IC assembly, automated inspection, and semiconductor testing
Ideal for operations where speed and handling precision are key.
From chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups.
Ensures reliable positioning and part safety at every stage, in a cleanroom or on a standard production floor.

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges:

• Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.

• Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.

• In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.

• Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Etiketler:

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

JEDEC IC Tepsileri

JEDEC Matris Tepsileri

IC Çip Tepsisi

Özel JEDEC Tepsileri

Waffle Paketi Çip Tepsileri

Elektronik Bileşenler Tepsisi

Çıplak Kalıp Tepsileri

Anti Statik Tepsiler

Waffle Paketi Kapak Klipsleri

Jel Yapışkan Kutu

Gofret Nakliye Kutusu

Metal Wafer Kaseti

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Customization:

ESD JEDEC Matris Tepsileri

SGS JEDEC Matris Tepsileri

SGS JEDEC Tepsisi

Tekrar kullanılan ESD Matris Tepsileri Optik Cihaz için JEDEC IC Nakliye Tepsisi

Elektronik Ürünler için SGS Plastik Siyah ESD JEDEC Matris Tepsileri

PCB Modül Paketleme ESD JEDEC Matrix Tepsileri 21PCS Yüksek Sıcaklığa Dayanıklı

Anti Korozif Siyah JEDEC Tepsi Tedarikçileri Nano Sensör İçin Döngü Yükleme

PES Malzemesi ESD JEDEC Matrix Tepsisi 0,76 mm'den az