2022 SIP Shenzhen China for Waffle Pack JEDEC Tray

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2022 SIP Shenzhen China for Waffle Pack JEDEC Tray

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February 22, 2023

Category Connection: Özel JEDEC Tepsileri

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Etiketler:

#Özel JEDEC Tepsileri #ISO JEDEC Matrix Tepsileri #Soket JEDEC Matrix Tepsileri

Brief: Discover the 2022 SIP Shenzhen China for Waffle Pack JEDEC Tray, a custom solution for secure component storage. These stackable trays, available in various materials, ensure efficient storage and transportation of sensitive electronic components like BGA ICs. Perfect for semiconductor manufacturing, testing, and shipping.

Related Product Features:

Custom JEDEC trays designed for secure storage and transportation of electronic components.
Stackable design maximizes space utilization in shipping and storage environments.
Ventilation holes prevent heat buildup during transportation.
Customizable to fit specific device shapes and sizes, including BGA, FBGA, and more.
Meets international standards for automated feeding systems and equipment compatibility.
Flatness maintained at MAX 0.76mm for precision handling.
Resistance range from 1.0x10e4 to 1.0x10e11Ω for durability.
Ideal for semiconductor manufacturing, testing, and IC shipping.

Sorular:

What types of components can be stored in these JEDEC trays?

These trays are designed for various electronic components, including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and more.
Are these JEDEC trays stackable?

Yes, these trays are stackable, which helps in maximizing storage and transportation space efficiently.
Can I get customized JEDEC trays for specific component sizes?

Absolutely! Hiner-pack offers 100% customized JEDEC tray solutions tailored to your specific component shapes and sizes.
What are the applications of these JEDEC trays?

These trays are widely used in semiconductor manufacturing, assembly, testing, and secure shipping of integrated circuits (ICs) and other sensitive devices.