Siyah MPPO ESD bileşen tepsisi BGA IC cihazları için 7.62 mm kalınlığında

Örnek Ekran
June 12, 2024
Video Description:
Discover the Black MPPO ESD Component Tray, 7.62mm thick, designed for BGA IC Devices. Secure, stackable, and fully traceable, this JEDEC tray streamlines logistics in fast-paced manufacturing environments. Ideal for various IC packaging solutions.