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High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

Marka Adı: Hiner-pack
Model Numarası: HN24230
Moq: 500 adet
fiyat: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Ödeme Şartları: T/T
Tedarik Yeteneği: 2000 adet/gün
Ayrıntılı Bilgiler
Menşe yeri:
Çin
Sertifika:
ROHS, ISO
Tepsi Ağırlığı:
Genellikle Kavite Başına 500 Grama Kadar Değişir
Renk:
ESD koruması için genellikle siyah veya koyu gri
Kalite Güvencesi:
Teslimat garantisi, güvenilir kalite
Kavite Boyutu:
11x16,3x2,47 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Kalıp tipi:
Enjeksiyon
Yeniden kullanılabilir:
Evet
Tepsi Şekli:
Dikdörtgen
Temiz Sınıf:
Genel ve Ultrasonik Temizleme
IC Türü:
BGA,QFP,QFN,LGA,PGA
Paketleme seviyesi:
Taşıma Paketi
Düzlük:
0,76 mm'den az
Kapasite:
6x18=108 Adet
Ambalaj bilgileri:
karton, palet
Yetenek temini:
2000 adet/gün
Vurgulamak:

JEDEC IC tray for packaging

,

thin JEDEC IC tray

,

IC packaging tray with warranty

Ürün Tanımı
Thin JEDEC Tray for IC Packaging 
Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity.
Key Features/ Benefits 
  • Lower cost solution
  • Lightweight design
  • High storage efficiency
  • Easy handling
Specifications
Brand Hiner-pack
Model  HN24230
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 11x16.3x2.47 mm
Matrix QTY 6x18=108 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Consumer IC
  • Standard packaging
  • Semiconductor fabs
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers